Abstract
A unified creep plasticity (UCP) model for Sn-Pb solder is developed in this paper. Stephens and Frear [1] studied the creep behavior of near-eutectic 60Sn-40Pb solder subjected to low strain rates and found that the inelastic (creep and plastic) strain rate could be accurately described using a hyperbolic Sine function of the applied effective stress. A recently developed high-rate servo-hydraulic method was employed to characterize the temperature and strain-rate dependent stress-strain behavior of eutectic Sn-Pb solder over a wide range of strain rates (10-4 to 102 per second) and temperatures (-60°C to +100°C). The steady-state, inelastic strain rate data from these latest experiments were also accurately captured by the hyperbolic Sine function developed by Stephens and Frear [1]. Thus, this equation was used as the basis for the UCP model for Sn-Pb solder developed in this paper. Copyright © 2010 MS&T'10®.
| Original language | English |
|---|---|
| Title of host publication | Materials Science and Technology Conference and Exhibition 2010, MS and T'10 |
| Pages | 824-833 |
| Number of pages | 10 |
| Volume | 2 |
| State | Published - Dec 1 2010 |
| Externally published | Yes |
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