Skip to main navigation Skip to search Skip to main content

Advanced compound semiconductor and silicon fabrication techniques for next-generation solar power systems

  • G. N. Nielson
  • , M. Okandan
  • , J. L. Cruz-Campa
  • , V. P. Gupta
  • , P. J. Resnick
  • , C. A. Sanchez
  • , S. M. Paap
  • , B. Kim
  • , W. C. Sweatt
  • , A. L. Lentine
  • , J. G. Cederberg
  • , A. Tauke-Pedretti
  • , B. H. Jared
  • , B. J. Anderson
  • , R. M. Biefeld
  • , J. S. Nelson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Microsystem technologies have the potential to significantly improve the performance, reduce the cost, and extend the capabilities of solar power systems. These benefits are possible due to a number of significant beneficial scaling effects within solar cells, modules, and systems that are manifested as the size of solar cells decrease to the sub-millimeter range. To exploit these benefits, we are using advanced fabrication techniques to create solar cells from a variety of compound semiconductors and silicon that have lateral dimensions of 250 - 1000 μm and are 1 - 20 μm thick. These fabrication techniques come out of relatively mature microsystem technologies such as integrated circuits (IC) and microelectromechanical systems (MEMS) which provide added supply chain and scale-up benefits compared to even incumbent PV technologies. © The Electrochemical Society.
Original languageEnglish
Title of host publicationECS Transactions
Pages351-359
Number of pages9
Volume50
Edition6
DOIs
StatePublished - Jan 1 2013
Externally publishedYes

Fingerprint

Dive into the research topics of 'Advanced compound semiconductor and silicon fabrication techniques for next-generation solar power systems'. Together they form a unique fingerprint.

Cite this