Abstract
Multivariate statistical analysis methods have been applied to scanning transmission electron microscopy (STEM) energy-dispersive X-ray spectral images. The particular application of the multivariate curve resolution (MCR) technique provides a high spectral contrast view of the raw spectral image. The power of this approach is demonstrated with a microelectronics failure analysis. Specifically, an unexpected component describing a chemical contaminant was found, as well as a component consistent with a foil thickness change associated with the focused ion beam specimen preparation process. The MCR solution is compared with a conventional analysis of the same spectral image data set. © 2006 Microscopy Society of America.
| Original language | English |
|---|---|
| Title of host publication | Microscopy and Microanalysis |
| Pages | 538-544 |
| Number of pages | 7 |
| Volume | 12 |
| Edition | 6 |
| DOIs | |
| State | Published - Dec 1 2006 |
| Externally published | Yes |
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