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Atomic layer deposition of Al2O3/ZnO nano-scale films for gold RF MEMS

  • F. W. DelRio
  • , C. F. Herrmann
  • , N. Hoivik
  • , S. M. George
  • , V. M. Bright
  • , J. L. Ebel
  • , R. E. Strawser
  • , R. Cortez
  • , K. D. Leedy

Research output: Contribution to journalConference articlepeer-review

12 Scopus citations

Abstract

Atomic layer deposition (ALD) was used to create an Al2O 3/ZnO thin film for gold capacitive RF MEMS switches. These films exhibited a widely tunable range of physical properties, allowing the creation of a material capable of dissipating trapped charges and maximizing the on-capacitance of the switch. Predicted pull-down voltages of the ALD-coatcd switches underestimated the experimental findings due to residual stresses in the ALD film and annealing of the gold during ALD deposition. Switch cycles to failure were measured using a 10 dBm, 10 GHz, CW signal with a bipolar actuation voltage of 25-55 V. Preliminary testing showed lifetimes of 400 million cycles using 50/50 ALD Al2O3/ZnO films, with ultimate failure due to moisture-induced stiction and particulate contamination, not dielectric charging. The insertion loss and isolation for the switches was typically < 0.35 dB and > 25 dB, respectively, over a 10-25 GHz frequency range.

Original languageEnglish
Pages (from-to)1923-1926
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
StatePublished - 2004
Externally publishedYes
Event2004 IEEE MITT-S International Microwave Symposium Digest - Fort Worth, TX, United States
Duration: Jun 6 2004Jun 11 2004

Keywords

  • Atomic layer deposition
  • Capacitive switches
  • Dielectric films
  • Reliability
  • RF MEMS

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