Abstract
Nanocrystalline copper thin films with as-deposited Σ3 twin boundaries were indented while immersed in liquid nitrogen. Quantification using precession-enhanced electron diffraction determined the crystallographic texture and grain-to-grain misorientation of the undeformed, pile-up and compressed regions. Grains in the undeformed region retained a high density of Σ3 recrystallization twins, whereas the pile-up showed significant coarsening, prevalent Σ7 subgrain formation and a decrease in twin boundaries. The abnormal grain growth is attributed to a detwinning mechanism. The compressed region showed significant grain refinement. © 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 781-784 |
| Number of pages | 4 |
| Journal | Scripta Materialia |
| Volume | 68 |
| Issue number | 10 |
| DOIs | |
| State | Published - May 1 2013 |
| Externally published | Yes |
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