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Early stage dynamic damage and the role of grain boundary type

  • Ellen Kathleen Cerreta
  • , A. Perez-Bergquist
  • , Darcie Dennis-Koller
  • , Carl Patrick Trujillo
  • , George Thompson Gray
  • , C. Brandl
  • , Timothy Clark Germann
  • , J. P. Escobedo

Research output: Contribution to journalArticlepeer-review

55 Scopus citations

Abstract

The role of grain boundary type in the early stages of dynamic damage evolution in copper has been investigated. Through a combination of polycrystalline and large-grained specimens, it has been shown that Σ3 and low-angle boundaries are resistant to void nucleation during shock loading to peak compressive stresses between 1.5 and 2.5 GPa. It is postulated that these boundaries promote slip transmission or secondary slip activation and thereby relieve the stress concentrations necessary for void nucleation at a boundary.

Original languageEnglish
Pages (from-to)638-641
Number of pages4
JournalScripta Materialia
Volume66
Issue number9
DOIs
StatePublished - May 1 2012

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