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Effects of 2 MeV Ge irradiation on AlGaN/GaN high electron mobility transistors

  • Erica A. Douglas
  • , Edward Bielejec
  • , Patrick Frenzer
  • , Bradley R. Yates
  • , Stephen J. Pearton
  • , Chien Fong Lo
  • , Lu Liu
  • , Tsung Sheng Kang
  • , Fan Ren

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

The dc characteristics of AlGaN/GaN high electron mobility transistors (HEMTs) were measured before and after irradiation with 2 MeV Ge ions at doses from 5 × 1010 to 5 × 1012 cm-2. The drain current, gate leakage current, and transconductance decreased monotonically with dose, while the drain-source resistance increased to a much greater extent than observed previously for proton irradiation of similar devices. The data are consistent with a strong decrease in electron concentration in the HEMT channel. During off-state electrical stressing of AlGaN/GaN HEMTs, the typical critical voltage for unirradiated devices was ∼13 V. By sharp contrast, no critical voltage was detected for proton irradiated HEMTs up to 35 V, indicating that the Ge irradiation had a strong influence on the electric field distribution near the gate electrode. © 2013 American Vacuum Society.
Original languageEnglish
JournalJournal of Vacuum Science and Technology B: Nanotechnology and Microelectronics
Volume31
Issue number2
DOIs
StatePublished - Jan 1 2013
Externally publishedYes

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