TY - GEN
T1 - Experimental investigation of thermal transport mechanisms through a nanoscale point contact
AU - Pettes, Michael Thompson
AU - Shi, Li
PY - 2011/12/1
Y1 - 2011/12/1
N2 - Using a silicon nitride cantilever with an integral Si tip and a micro-fabricated Pt-C resistance thermometer placed close to the tip, we have measured the thermal contact resistance of a nanoscale Si point contact in an ultrahigh vacuum atomic force microscope at near room temperature. The temperature of the cantilever tip was observed to remain constant during approach to, while in contact with, and during retraction from the Si substrate, while a large temperature drop was observed at the points of contact and separation, suggesting negligible nearfield radiation transport in the experiment reported here. Detailed contact mechanics calculations of the contact diameter and modeling of the nanocontact show that solid-solid conduction with phonon transmission coefficient of at least 0.12 is the dominant mode of heat transfer through the nanoscale contact. Copyright © 2011 by ASME.
AB - Using a silicon nitride cantilever with an integral Si tip and a micro-fabricated Pt-C resistance thermometer placed close to the tip, we have measured the thermal contact resistance of a nanoscale Si point contact in an ultrahigh vacuum atomic force microscope at near room temperature. The temperature of the cantilever tip was observed to remain constant during approach to, while in contact with, and during retraction from the Si substrate, while a large temperature drop was observed at the points of contact and separation, suggesting negligible nearfield radiation transport in the experiment reported here. Detailed contact mechanics calculations of the contact diameter and modeling of the nanocontact show that solid-solid conduction with phonon transmission coefficient of at least 0.12 is the dominant mode of heat transfer through the nanoscale contact. Copyright © 2011 by ASME.
UR - https://www.scopus.com/pages/publications/84869190013
M3 - Conference contribution
T3 - ASME 2011 International Mechanical Engineering Congress and Exposition,
IMECE 2011
SP - 365
EP - 370
BT - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
T2 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Y2 - 1 December 2011
ER -