Abstract
Silicon carbide (SiC) is a wide bandgap semiconductor of interest in microelectromechanical systems. We demonstrate the growth of SiC nanoparticles using silicon dioxide (Si O2) films deposited from tetraethylorthosilicate [TEOS, Si (O C2 H5) 4]. High-temperature annealing allows residual carbon to diffuse to and react with the silicon substrate to form SiC nanoparticles (rather than a uniform SiC film). The growth of the SiC nanoparticles can be controlled by annealing conditions or eliminated by flowing oxygen during the film deposition. These particles are revealed by a standard wet etchant and provide an effective method to reduce adhesion between micromachined surfaces. © 2006 The Electrochemical Society.
| Original language | English |
|---|---|
| Journal | Electrochemical and Solid-State Letters |
| Volume | 10 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 1 2007 |
| Externally published | Yes |
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