Abstract
Semiconductor-insulator interfaces play an important role in the reliability of integrated devices; however, the impact of these interfaces on the physical mechanisms related to single-event effects has not been previously reported. We present experimental data that demonstrate that single-event charge collection can be impacted by changes in interface quality. The experimental data, combined with simulations, show that single-event response may depend on surface recombination at interface defects. The effect depends on strike location and increases with increasing linear energy transfer (LET). Surface recombination can affect single-event charge collection for interfaces with a surface recombination velocity (SRV) of 1000 cm/s and is a dominant charge collection mechanism with SRV > 10^{5} cm/s.
| Original language | English |
|---|---|
| Pages (from-to) | 305-311 |
| Number of pages | 7 |
| Journal | IEEE Transactions on Nuclear Science |
| Volume | 68 |
| Issue number | 3 |
| DOIs | |
| State | Published - Mar 1 2021 |
| Externally published | Yes |
Fingerprint
Dive into the research topics of 'Impact of Surface Recombination on Single-Event Charge Collection in an SOI Technology'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver