Abstract
Nanoindentation-induced deformation and fracture of thin polystyrene (PS) films on glass substrates were characterized using visible-light microscopy and atomic force microscopy (AFM). Two film thicknesses, 2 and 3.5 μm were studied. It was difficult to induce delamination in the 2-μm film while the 3.5-μm film delaminated easily under indentation loads of 150 mN and higher. AFM cross-section analysis of the deformation and fracture geometry revealed that the ratio of the delamination radius to contact radius was between 3 and 4. Analysis of the fracture surface on the glass side indicates that substrate cracking acts as a trigger for initiation and propagation of interfacial cracks. Crack-arrest marks and process-zone marks were also observed by AFM imaging. The interfacial fracture toughness, or practical work of adhesion, was evaluated following two methods based on the indentation-induced delamination and a process-zone analysis. The fracture toughness was found to be approximately 0.6 J/m2 for the 3.5-μm PS film on glass. AFM examination of the glass surface after indentation also showed fine flow lines around the indentation impression, indicating plastic deformation of glass. © 2002 Elsevier Science B.V. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 174-183 |
| Number of pages | 10 |
| Journal | Thin Solid Films |
| Volume | 416 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - Sep 2 2002 |
| Externally published | Yes |
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