Abstract
In this letter, we present interfacial fracture toughness data for a polymer-metal interface where tests were conducted at various test temperatures T and loading rates δ˙. An adhesively bonded asymmetric double cantilever beam (ADCB) specimen was utilized to measure toughness. ADCB specimens were created by bonding a thinner, upper adherend to a thicker, lower adherend (both 6061 T6 aluminum) using a thin layer of epoxy adhesive, such that the crack propagated along the interface between the thinner adherend and the epoxy layer. The specimens were tested at T from 25 to 65 °C and δ˙ from 0.002 to 0.2 mm/s. The measured interfacial toughness Γ increased as both T and δ˙ increased. For an ADCB specimen loaded at a constant δ˙, the energy release rate G increases as the crack length a increases. For this reason, we defined rate effects in terms of the rate of change in the energy release rate G˙. Although not rigorously correct, a formal application of time–temperature superposition (TTS) analysis to the Γ data provided useful insights on the observed dependencies. In the TTS-shifted data, Γ decreased and then increased for monotonically increasing G˙. Thus, the TTS analysis suggests that there is a minimum value of Γ. This minimum value could be used to define a lower bound in Γ when designing critical engineering applications that are subjected to T and δ˙ excursions.
| Original language | English |
|---|---|
| Pages (from-to) | 361-367 |
| Number of pages | 7 |
| Journal | International Journal of Fracture |
| Volume | 247 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 2024 |
| Externally published | Yes |
Keywords
- Asymmetric double cantilever beam
- Fracture toughness
- Polymer-metal interfaces
- Small-scale yielding
- Time–temperature superposition
Fingerprint
Dive into the research topics of 'Interpreting test temperature and loading rate effects on the fracture toughness of polymer-metal interfaces via time–temperature superposition'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver