Abstract
The etch rates of NH4OH:H2O2 and C6H8O7:H2O2 for GaAs and GaSb have been investigated to develop a selective etch for GaAs substrates and to isolate GaSb epilayers grown on GaAs. The NH4OH:H2O2 solution has a greater etch rate differential for the GaSb/GaAs material system than C6H8O7:H2O2 solution. The selectivity of NH4OH:H2O2 for GaAs/GaSb under optimized etch conditions has been observed to be as high as 11,000 ± 2000, whereas that of C6H8O7:H2O2 has been measured up to 143 ± 2. The etch contrast has been verified by isolating 2-μm-thick GaSb epilayers that were grown on GaAs substrates. GaSb membranes were tested and characterized with high-resolution x-ray diffraction and atomic force microscopy.
| Original language | English |
|---|---|
| Pages (from-to) | 1327-1331 |
| Number of pages | 5 |
| Journal | Journal of Electronic Materials |
| Volume | 44 |
| Issue number | 5 |
| DOIs | |
| State | Published - Mar 24 2015 |
| Externally published | Yes |
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