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Modular MEMS-Based Optical Cross-Connect with Large Port-Count

  • J. I. Dadap
  • , P. B. Chu
  • , I. Brener
  • , C. Pu
  • , C. D. Lee
  • , K. Bergman
  • , N. Bonadeo
  • , T. Chau
  • , M. Chou
  • , R. Doran
  • , R. Gibson
  • , R. Harel
  • , J. J. Johnson
  • , S. S. Lee
  • , S. Park
  • , D. R. Peale
  • , R. Rodriguez
  • , D. Tong
  • , M. Tsai
  • , C. Wu
  • W. Zhong, E. L. Goldstein, L. Y. Lin, J. A. Walker

Research output: Contribution to journalArticlepeer-review

33 Scopus citations

Abstract

We describe and demonstrate a modular microelectromechanical systems (MEMS)-based optical cross-connect (OXC) architecture. The OXC port count increases modularly by adding new optical modules, and a maximum cross-connectivity of ∼ 350 × 350 can be achieved in the current design. Each optical module has 16 ports with closed-loop servo-controlled MEMS mirrors. Using a prototype OXC system, mounted in a standard telecommunications equipment bay comprising optical modules, folding mirrors, and other optical elements, we demonstrate switching times of less than 10 ms, excellent optical power stability of less than ±0.15-dB variation, and immunity to stochastic vibrations. An automatic power peak-up process is performed when the power falls below 0.5 dB off the maximum coupled power for any connection.
Original languageEnglish
Pages (from-to)1773-1775
Number of pages3
JournalIEEE Photonics Technology Letters
Volume15
Issue number12
DOIs
StatePublished - Jan 1 2003
Externally publishedYes

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