Abstract
A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photo voltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting
| Original language | American English |
|---|---|
| Patent number | US 10,243,095 B2 |
| State | Published - Mar 26 2019 |
| Externally published | Yes |
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