Abstract
Fracture in amorphous silica is studied using million-atom molecular dynamics simulations. The dynamics of crack propagation, internal stress fields, and the morphology of fracture surfaces are examined as a function of temperature and strain rate. At 300K and 600K we observe brittle fracture: internal stress increases to a critical value (typically 2 - 3 GPa) and then turns over when the crack reaches a terminal speed on the order of half the Rayleigh wave speed. At 900K crack propagation slows down dramatically due to plastic deformation and the material becomes ductile.
| Original language | English |
|---|---|
| Title of host publication | Materials Research Society Symposium - Proceedings |
| Pages | 267-272 |
| Number of pages | 6 |
| Volume | 455 |
| State | Published - Jan 1 1997 |
| Externally published | Yes |
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