@inproceedings{6c77dc4aa7ba4133b8c4b67d0dea7045,
title = "Molecular dynamics study of lead free interconnect materials for electronic packaging applications",
author = "H. Dong and K. Moon and L. Fan and C. Wong and M. Baskes",
year = "2006",
month = mar,
day = "26",
language = "English",
volume = "231",
series = "ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY",
booktitle = "ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY",
note = "231st National Meeting of the American-Chemical-Society ; Conference date: 26-03-2006",
}