On the bending strength of single-crystal silicon theta-like specimens

A new theta geometry was developed for microscale bending strength measurements. This new "gap" theta specimen was a modification of the arch theta specimen that enabled microscale tensile testing. The gap theta specimen was demonstrated here on single-crystal silicon, microfabricated using two different etch processes. The resulting sample strengths were described by three-parameter Weibull distributions derived from parameters determined using established arch theta strengths, assuming a specimen-geometry and-size invariant flaw distribution and an approximate loading configuration.