Abstract
Oxide-defined 850-nm vertical cavity surface emitting lasers (VCSEL) on Si substrates were fabricated employing a novel low-temperature wafer bonding technique. Devices exhibit a differential quantum efficiency as high as 53% and a light output power of 7.1 mW at room temperature without a heat sink, illustrating low thermal resistance of the bonding interface.
| Original language | English |
|---|---|
| Pages (from-to) | 110-112 |
| Number of pages | 3 |
| Journal | IEEE Photonics Technology Letters |
| Volume | 12 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 1 2000 |
| Externally published | Yes |
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