Abstract
We use precession electron diffraction to investigate the crystallographic character of copper (Cu)-tungsten (W) nanocomposites fabricated via physical vapor co-deposition at 400 °C. We observe sub-micron-scale regions, where apparently disconnected Cu and W grains have near-identical crystallographic orientations. This persistence of grain orientations suggests Cu and W grains within these regions are interconnected in 3-D when they first form and may be considered as intercalated, sub-micron-scale “super-grains”. Indeed, atom probe tomography provides direct evidence of 3-D interconnectivity of W domains. Our findings shed light on the structure and self-organization mechanisms of nanocomposites formed by spontaneous phase separation of co-deposited metals.
| Original language | English |
|---|---|
| Article number | 113677 |
| Journal | Scripta Materialia |
| Volume | 194 |
| DOIs | |
| State | Published - Mar 15 2021 |
| Externally published | Yes |
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