Reduction of vanadium diffusivity within copper grain boundaries due to enhanced binding

T. Y. Liu, E. Sheu, M. Tavakolzadeh, D. J. Williams, J. K. Baldwin, M. J. Demkowicz

Research output: Contribution to journalArticlepeer-review

Abstract

We investigate permeation of vanadium (V) through copper (Cu) layers in V/Cu/niobium (Nb) and molybdenum (Mo)/Cu/V tri-layer composites and compare it with the permeation behavior of Nb. Despite their low solubility in single-crystal Cu, both V and Nb permeate readily due to short-circuit transport through Cu grain boundaries (GBs). However, Nb permeates preferentially to V. Atomistic simulations suggest that this difference is due to lower V diffusivity at general GBs in Cu, compared to Nb. The lower V diffusivity, in turn, arises from stronger V binding to the boundary, which manifests as a greater equilibrium GB concentration as well as a higher activation energy for GB diffusion.

Original languageEnglish
Article number116515
JournalScripta Materialia
Volume258
DOIs
StatePublished - Mar 15 2025

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