Tailoring copper current collector roughness and crystallographic orientation to improve lithium plating

Secondary lithium metal batteries are of great interest due to a high theoretical energy density, but rechargeability is limited by the formation of lithium dendrites that lead to internal short circuits and catastrophic cell failure. Mitigating dendrites through uniform current distribution at the current collector is a promising solution to enabling long cycle life of lithium metal electrodes. Here, the impact of copper crystal orientation and roughness on electrochemically deposited lithium morphology is studied. For 50 cycles, the capacity retention from greatest to least followed polycrystalline copper 95 ± 1 % (MC-PC) ≥ 94.55 ± 0.01 % Cu (110) > 93.0 ± 0.4 % Cu(111) > 75.8 ± 0.1 % Cu(100). Cu(100) performed the worst in all cases with shorts occurring frequently before reaching 50 cycles. Cryo-scanning electron microscopy images showed that after 50 cycles, MC-PC Cu had the best lithium morphology, but at early cycles, Cu(111) formed the densest lithium layer. MC-PC Cu had the most uniform lithium nucleation which may have been caused by increased roughness relative to the single crystal samples. When polycrystalline Cu (F-PC) roughness was systematically controlled, the cumulative Coulombic efficiency increased from about 0.3–0.5 with increasing roughness from an R_a of about 10–40 nm. Lastly, plating rates were studied. Slower rates of 0.25 mA/cm² exhibited denser lithium morphology in all cases as compared to 0.5 and 1.0 mA/cm², but the relative porosity of Li deposited on the different current collectors depended on the rate applied.