The effect of ballistic electron transport on copper-niobium thermal interface conductance

Ramez Cheaito; John C. Duda; Thomas E. Beechem; Edward S. Piekos; Jon F. Ihlefeld; Amit Misra; Patrick E. Hopkins; Khalid Hattar; Jon K. Baldwin

doi:10.1115/HT2013-17541

The effect of ballistic electron transport on copper-niobium thermal interface conductance

Ramez Cheaito
, John C. Duda
, Thomas E. Beechem
, Edward S. Piekos
, Jon F. Ihlefeld
, Amit Misra
, Patrick E. Hopkins
, Khalid Hattar
, Jon K. Baldwin

Los Alamos National Laboratory

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

The thermal conductivities of 1μm copper-niobium multilayer films of different period thicknesses are measured by time- domain thermoreflectance at room temperature. The values for thermal conductivity are then used to calculate the thermal conductance between Cu/Nb interfaces using a series resistors model. Results show that Cu/Nb interface conductance increases with the decrease in period thickness reaching a value as high as 20 GWm-2K -1 for a 1x1 Cu/Nb multilayer. At shorter period thicknesses, ballistic electron transport dominates the thermal transport across this interface resulting in high interface conductance. The results are well described by a model that accounts for both ballistic and diffusive transport of electrons. This model assumes that an electron on one side of a metalmetal multilayer may not scatter at the interface but rather move ballistically on to the adjacent material and scatter in the adjacent material. Copyright © 2013 by ASME.

Original language	English
Title of host publication	ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013
Volume	1
DOIs	https://doi.org/10.1115/HT2013-17541
State	Published - Dec 1 2013

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10.1115/HT2013-17541

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Cheaito, R., Duda, J. C., Beechem, T. E., Piekos, E. S., Ihlefeld, J. F., Misra, A., Hopkins, P. E., Hattar, K., & Baldwin, J. K. (2013). The effect of ballistic electron transport on copper-niobium thermal interface conductance. In ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013 (Vol. 1) https://doi.org/10.1115/HT2013-17541

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title = "The effect of ballistic electron transport on copper-niobium thermal interface conductance",

abstract = "The thermal conductivities of 1μm copper-niobium multilayer films of different period thicknesses are measured by time- domain thermoreflectance at room temperature. The values for thermal conductivity are then used to calculate the thermal conductance between Cu/Nb interfaces using a series resistors model. Results show that Cu/Nb interface conductance increases with the decrease in period thickness reaching a value as high as 20 GWm-2K -1 for a 1x1 Cu/Nb multilayer. At shorter period thicknesses, ballistic electron transport dominates the thermal transport across this interface resulting in high interface conductance. The results are well described by a model that accounts for both ballistic and diffusive transport of electrons. This model assumes that an electron on one side of a metalmetal multilayer may not scatter at the interface but rather move ballistically on to the adjacent material and scatter in the adjacent material. Copyright {\textcopyright} 2013 by ASME.",

author = "Ramez Cheaito and Duda, \{John C.\} and Beechem, \{Thomas E.\} and Piekos, \{Edward S.\} and Ihlefeld, \{Jon F.\} and Amit Misra and Hopkins, \{Patrick E.\} and Khalid Hattar and Baldwin, \{Jon K.\}",

year = "2013",

month = dec,

day = "1",

doi = "10.1115/HT2013-17541",

language = "English",

isbn = "9780791855478",

volume = "1",

booktitle = "ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013",

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Cheaito, R, Duda, JC, Beechem, TE, Piekos, ES, Ihlefeld, JF, Misra, A, Hopkins, PE, Hattar, K & Baldwin, JK 2013, The effect of ballistic electron transport on copper-niobium thermal interface conductance. in ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013. vol. 1. https://doi.org/10.1115/HT2013-17541

The effect of ballistic electron transport on copper-niobium thermal interface conductance. / Cheaito, Ramez; Duda, John C.; Beechem, Thomas E. et al.
ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013. Vol. 1 2013.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - The effect of ballistic electron transport on copper-niobium thermal interface conductance

AU - Cheaito, Ramez

AU - Duda, John C.

AU - Beechem, Thomas E.

AU - Piekos, Edward S.

AU - Ihlefeld, Jon F.

AU - Misra, Amit

AU - Hopkins, Patrick E.

AU - Hattar, Khalid

AU - Baldwin, Jon K.

PY - 2013/12/1

Y1 - 2013/12/1

N2 - The thermal conductivities of 1μm copper-niobium multilayer films of different period thicknesses are measured by time- domain thermoreflectance at room temperature. The values for thermal conductivity are then used to calculate the thermal conductance between Cu/Nb interfaces using a series resistors model. Results show that Cu/Nb interface conductance increases with the decrease in period thickness reaching a value as high as 20 GWm-2K -1 for a 1x1 Cu/Nb multilayer. At shorter period thicknesses, ballistic electron transport dominates the thermal transport across this interface resulting in high interface conductance. The results are well described by a model that accounts for both ballistic and diffusive transport of electrons. This model assumes that an electron on one side of a metalmetal multilayer may not scatter at the interface but rather move ballistically on to the adjacent material and scatter in the adjacent material. Copyright © 2013 by ASME.

AB - The thermal conductivities of 1μm copper-niobium multilayer films of different period thicknesses are measured by time- domain thermoreflectance at room temperature. The values for thermal conductivity are then used to calculate the thermal conductance between Cu/Nb interfaces using a series resistors model. Results show that Cu/Nb interface conductance increases with the decrease in period thickness reaching a value as high as 20 GWm-2K -1 for a 1x1 Cu/Nb multilayer. At shorter period thicknesses, ballistic electron transport dominates the thermal transport across this interface resulting in high interface conductance. The results are well described by a model that accounts for both ballistic and diffusive transport of electrons. This model assumes that an electron on one side of a metalmetal multilayer may not scatter at the interface but rather move ballistically on to the adjacent material and scatter in the adjacent material. Copyright © 2013 by ASME.

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DO - 10.1115/HT2013-17541

M3 - Conference contribution

SN - 9780791855478

VL - 1

BT - ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013

ER -

Cheaito R, Duda JC, Beechem TE, Piekos ES, Ihlefeld JF, Misra A et al. The effect of ballistic electron transport on copper-niobium thermal interface conductance. In ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013. Vol. 1. 2013 doi: 10.1115/HT2013-17541

The effect of ballistic electron transport on copper-niobium thermal interface conductance

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