Skip to main navigation Skip to search Skip to main content

The study of grain boundary thickness using electron diffraction techniques

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

An electron diffraction technique has been developed to study the thickness of grain boundaries in polycrystalline specimens. Grain boundaries with a periodic structure in Al2O3, Cu-Bi and Au, were examined in an edge-on orientation using electron microscopy and diffraction. Each boundary gave rise to streaks in the diffraction pattern, the length of which was inversely related to the thickness of the boundary. For each boundary studied the magnitude of the boundary thickness was similar to the periodicity of the boundary, as determined from the image and the diffraction pattern. © 1980 Taylor & Francis Group, LLC.
Original languageEnglish
Pages (from-to)467-475
Number of pages9
JournalPhilosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties
Volume41
Issue number4
DOIs
StatePublished - Jan 1 1980
Externally publishedYes

Fingerprint

Dive into the research topics of 'The study of grain boundary thickness using electron diffraction techniques'. Together they form a unique fingerprint.

Cite this