Transmission electron microscopy study of the role of interface structure at 1 0 0/1 1 1 boundaries in a shocked copper multicrystal

While shock loading has long been used to investigate dynamic damage evolution in materials, the role of interface structure in the response of shock-loaded polycrystalline materials has largely been ignored. In this work, a specially fabricated multicrystalline Cu specimen is used to interrogate the role of interface structure on microstructural and substructural evolution in shock-loaded materials. Results show that, under shock, grain boundaries respond differently as a function of structure.